Troubleshooting • New "Active Cooler" + No contact to chip?

Hello, I received my new "Active Cooler" and immediately noticed that the RP1 chip now also has a thermal pad and small changes like the spring.

Unfortunately, the corner where the Power-Management-IC is can be pressed down as if there was no contact with the chip (Power-Management-IC) and later on in the picture I saw that the thermal pad of the SoC is placed too high, could that be the reason? I tried to take the cooler off again but I think either the pins will break or the PCB...

It would be great if you could check whether you can also press the cooler down at the corner and the contact is missing there (With the other cooler, which seems to be older and has 1 thermal pad less, this problem does not exist).

Btw. to me it looks like the SoC and WLAN/BLUETOOTH have the same thickness (1mm?). RP1 and Power-Management-IC have the same thickness (0.5mm?).




//EDIT
So I looked between the PCB and the cooler with a flashlight and there is definitely no contact. I think the thermal pad of the WLAN/BLUETOOTH has become a bit thicker and that is why there is no longer any contact

//EDIT
I've now taken a closer look at both and both have no contact. What is this thermal pad for?

Statistics: Posted by BitByte — Fri Jan 17, 2025 11:24 am — Replies 0 — Views 101

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